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[0] Mojarradi M, Binkley D, Blalock B, Andersen R, Ulshoefer N, Johnson T, Del Castillo L, A miniaturized neuroprosthesis suitable for implantation into the brain.IEEE Trans Neural Syst Rehabil Eng 11:1, 38-42 (2003 Mar)

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ref: -0 tags: Peter Ledochowitsch ECoG parylene fabrication MEMS date: 09-25-2014 16:54 gmt revision:0 [head]

IEEE-5734604 (pdf) Fabrication and testing of a large area, high density, parylene MEMS µECoG array

  • Details 5-layer platinum parylene process for high density ECoG arrays.

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ref: -0 tags: intracortical utah array fabrication MEMS Normann date: 08-14-2014 01:35 gmt revision:5 [4] [3] [2] [1] [0] [head]

PMID-1937509 A silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode array.

  • Campbell PK1, Jones KE, Huber RJ, Horch KW, Normann RA. (1991)
  • One of (but not the) first papers describing their methods / idea (I think).
  • First conf paper: {1294} (1988)
  • later adopted glass frit insulator --

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ref: Mojarradi-2003.03 tags: MEMS recording telemetry Normann Andersen wireless date: 01-15-2012 04:29 gmt revision:2 [1] [0] [head]

PMID-12797724[0] A miniaturized neuroprosthesis suitable for implantation into the brain.

  • Standard tricks: cascode configuration, deep-ohmic PMOS Devices for resistive feedback, wide PMOS weak-inversion input stage for good transconductance and low noise.
  • Varaible power for variable noise levels & bandwidths.
  • Wireless transceiver and power stage are in early concept stages.

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