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ref: -0 tags: plasma etch removal parylene DRIE date: 05-28-2013 18:47 gmt revision:2 [1] [0] [head]

Plasma removal of Parylene C

  • Ellis Meng, Po-Ying Li and Yu-Chong Tai USC / Caltech
  • Technics O2 plasma etch works, as do DRIE / RIE etch; all offer varying degrees of anisotropy, with the more intricate processes offering straighter sidewalls.
  • Suggested parameters for O2 etch is 200sccm / 200W.
  • Etch will be somewhat isotropic -- top of photoresist will be etched away, leading to ~15deg sloped sidewalls.
    • Hence, small parylene features will be narrowed by the 02 plasma.

{1231}
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ref: -0 tags: parylene interconnect monolithic integration silicon DRIE date: 02-26-2013 00:29 gmt revision:1 [0] [head]

A New Multi-Site Probe Array with Monolithically Integrated Parylene Flexible Cable for Neural Prostheses

    • Use DRIE to etch the back of the wafer after patterning the front. Clever!