Interfacial adhesion of polymeric coatings for microelectronic encapsulation
- Find that, after a pressure-cooker test, adhesion of polyimide PI-2610 (what we use) to SiO2 was weaker than to Al, SiN, and copper.
- Aluminum adhesion is quite good, at least to (only) 15 days @ 85C / 85% RH. Reference studies that find the adhesion to be 'acceptable' for the microelectronics industry.
- Should we use an aluminum adhesion layer? Less biocompatible metal than Ti, and more likely to degrade in saline.
- Found that copper adhesion actually went up with water exposure!
- Polyimide adheres more strongly to glass than epoxy following accelerated aging.
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