{1275} revision 0 modified: 03-10-2014 22:33 gmt

Adhesion Properties of Electroless-Plated Cu Layers on Polyimide Treated by Inductively Coupled Plasmas

  • O2 then N2/H2 ICP treatment of polyimide surfaces dramatically lowers the surface energy (as measured by contact angle), and increases the adhesion of palladium-catalyzed electroless copper.
  • Particularly, C-N bonds are increased as revealed by XPS.
  • No peel-strength measurements given.