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ref: -0 tags: parylene metal adhesion Stieglitz date: 08-15-2013 17:22 gmt revision:0 [head]

PMID-20119944 Characterization of parylene C as an encapsulation material for implanted neural prostheses.

  • On Si3N4, platinum, and a first film of parylene-C, satisfactory adhesion was achieved with silane A-174, even after steam sterilization. (>1 N/cm)
  • higher adhesion for the parylene that was deposited at lower pressures.
  • but: higher deposition pressures results in lower crystalinity.
  • [33] parylene can be used to build freestanding nanowires.
  • Parylene does not stick to polyimide.
  • Parylene sticks to parylene well if left untreated.
  • Annealing parylene dramatically increased crystalinity / decreases elongation to break.
  • The deposited parylene C layers on untreated and with oxygen plasma-treated samples delaminated immediately after contact with saline. The behavior was also observed at two out of three samples of the A-174 treated wafers, but not in this magnitude.
    • A potential reason for these results could be contamination of the samples during assembly or excessive treatment with the adhesion promoter.