{1240} revision 2 modified: 05-28-2013 18:47 gmt

Plasma removal of Parylene C

  • Ellis Meng, Po-Ying Li and Yu-Chong Tai USC / Caltech
  • Technics O2 plasma etch works, as do DRIE / RIE etch; all offer varying degrees of anisotropy, with the more intricate processes offering straighter sidewalls.
  • Suggested parameters for O2 etch is 200sccm / 200W.
  • Etch will be somewhat isotropic -- top of photoresist will be etched away, leading to ~15deg sloped sidewalls.
    • Hence, small parylene features will be narrowed by the 02 plasma.