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ref: Wise-1970.07 tags: Wise MEA silicon gold lithography date: 01-03-2012 19:05 gmt revision:3 [2] [1] [0] [head]

IEEE-4502738 (pdf) An Integrated-Circuit Approach to Extracellular Microelectrodes

  • Used lithography techniques & to make SiO2 & Au electrodes.
  • 2um tips.
    • Back then, small tips were deemed good; nowadays, we want larger, lower-impedance tips (fad?)
  • Most previous work is glass insulated metal electrodes [1][2]
    • C. Guld, a glass-covered platinum microelectrode. {1014}
  • Probes cannot exceed more than 50um from the edge of the chip carrier without cracking, which limits how close one may get to a given cell.

____References____

Wise, Kensall D. and Angell, James B. and Starr, Arnold An Integrated-Circuit Approach to Extracellular Microelectrodes Biomedical Engineering, IEEE Transactions on BME-17 3 238 -247 (1970)