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{1385}
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ref: -0 tags: tungsten eletropolishing hydroxide cleaning bath tartarate date: 03-28-2017 16:34 gmt revision:0 [head]

Method of electropolishing tungsten wire US 3287238 A

  • The bath is formed of 15% by weight sodium hydroxide, 30% by weight sodium potassium tartrate, and 55% by weight distilled water, with the bath temperature being between 70 and 100 F.
    • If the concentration of either the hydroxide or the tartrate is below the indicated minimum, the wire is electrocleaned rather than electropolished, and a matte finish is obtained rather than a specular surface.
    • If the concentration of either the hydroxide or the tartrate is greater than the indicated maximum, the electropolishing process is quite slow.
  • The voltage which is applied between the two electrodes 18 and 20 is from 16 to 18.5 volts, the current through the bath is 20 to 24 amperes, and the current density is 3,000 to 4,000 amperes per square foot of surface of wire in the bath.

{1382}
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ref: -0 tags: iridium oxide nanotube intracellular recording electroplate MEA date: 02-22-2017 22:41 gmt revision:0 [head]

PMID-24487777 Iridium oxide nanotube electrodes for sensitive and prolonged intracellular measurement of action potentials.

  • Electrodeposition of IrOx "magically" forms 500nm tubes.
  • Holes in Si3N4 / SiO2 were formed via e-beam lithography; underlying Pt wires via liftoff.
  • Showed long (minutes) intracellular access, though it tended to dip with time.

{1319}
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ref: -0 tags: polyimide epoxy potassium hydroxide etch adhesion date: 06-25-2015 00:28 gmt revision:0 [head]

Improvement in the adhesion of polyimide/epoxy joints using various curing agents

  • Used 1M KOH, ~2min, followed by 0.2M HCl for 6 min to ring-open the imide.
  • PMDA/ODA polyimide (Pyromellitic Dianhydride, single aromatic ring + 4,4 diamino diphenyl ether )
  • Epoxy of the DGEBA + linear amide or aromatic (3,3 methylenedianiline)
  • Best result was with a polyamide curing agent, and high-temp curing profile. Unlikely that this will work for us, parylene will decompose..

{1276}
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ref: -0 tags: polyimide silicon oxide aluminum adhesion pressure cooker date: 06-16-2014 21:28 gmt revision:2 [1] [0] [head]

Interfacial adhesion of polymeric coatings for microelectronic encapsulation

  • Find that, after a pressure-cooker test, adhesion of polyimide PI-2610 (what we use) to SiO2 was weaker than to Al, SiN, and copper.
  • Aluminum adhesion is quite good, at least to (only) 15 days @ 85C / 85% RH. Reference studies that find the adhesion to be 'acceptable' for the microelectronics industry.
    • Should we use an aluminum adhesion layer? Less biocompatible metal than Ti, and more likely to degrade in saline.
  • Found that copper adhesion actually went up with water exposure!
  • Polyimide adheres more strongly to glass than epoxy following accelerated aging.

{552}
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ref: notes-0 tags: CO2 global warming carbon dioxide indonesia brazil date: 03-14-2008 21:34 gmt revision:0 [head]

From the New Yorker, Feb 25:

  • "Just two countries - Indonesia and Brazil - account for ten percent of the greenhouse gasses released into the atmosphere. "
  • "During the next twenty-four hours the effect of losing forests in Brazil and Indonesia will be the same as if eight million people boarded airplanes at Heathrow airport and flew en mass to New York. "