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PMID-25112683 Subcellular Neural Probes from Single-Crystal Gold Nanowires
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PMID-25574019 Biomaterials. Electronic dura mater for long-term multimodal neural interfaces.
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tags: nanoprobe transmembrane intracellular thiol gold AFM juxtacellular
date: 02-06-2017 23:45 gmt
revision:3
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PMID-20212151 Fusion of biomimetic stealth probes into lipid bilayer cores
PMID-21469728 '''Molecular Structure Influences the Stability of Membrane Penetrating Biointerfaces.
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PMID-27256971 Multisite electrophysiological recordings by self-assembled loose-patch-like junctions between cultured hippocampal neurons and mushroom-shaped microelectrodes.
PMID-23380931 Multi-electrode array technologies for neuroscience and cardiology
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{1353} |
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tags: PEDOT electropolymerization electroplating gold TFB borate counterion acetonitrile
date: 10-18-2016 07:49 gmt
revision:3
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PMID-20715789 Investigation of near ohmic behavior for poly(3,4-ethylenedioxythiophene): a model consistent with systematic variations in polymerization conditions.
PMID-24576579 '''Improving the performance of poly(3,4-ethylenedioxythiophene) for brain–machine interface applications"
PEDOT-modified integrated microelectrodes for the detection of ascorbic acid, dopamine and uric acid
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{1270} |
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tags: gold micrograin recording electrodes electroplating impedance
date: 10-17-2016 20:28 gmt
revision:5
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PMID-23071004 Gold nanograin microelectrodes for neuroelectronic interfaces.
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PMID-21379404 Creating low-impedance tetrodes by electroplating with additives
Conclusion: 75% PEG, commercial electropating solution, 0.1ua current pluses to 250K or less.
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{1299} |
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tags: wirebonding finishes gold nickel palladium electroless electrolytic
date: 09-21-2014 02:53 gmt
revision:3
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Why palladium? To prevent black nickel: http://tayloredge.com/reference/Electronics/PWB/BlackPad_ITRI_Round1.PD Introduction The use of electroless nickel / immersion gold (E.Ni/I.Au) as a circuit board finish has grown significantly in the last few years. It provides a flat board finish, is very solderable, provides a precious metal contact surface and the nickel strengthens the plated holes. However, as the usage of E.Ni/I.Au increased, a problem was found on BGA (Ball Grid Array) components. An open or fractured solder joint sometimes appears after board assembly on the occasional BGA pad. The solder had wet and dissolved the gold and formed a weak intermetallic bond to the nickel. This weak bond to the nickel readily fractures under stress or shock, leaving an open circuit. The incidence of this problem appears to be very sporadic and a low ppm level problem, but it is very unpredictable. A BGA solder joint cannot be touched-up without the component being removed. After the BGA component is removed, a black pad is observed at the affected pad site. This black pad is not readily solderable, but it can be repaired. From: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&Thread_ID=4430 You don't have enough gold. Your 2uin is too porous and is allowing the nickel to corrode. Prove that this by hand soldering to these pads with a more active flux, like a water soluble solder paste, than you are using. You must have at least 3uin of immersion gold. Seriously consider >5uin. Your nickel thickness is fine. Although if you wanted to trade costs, consider giving-up nickel to 150uin thickness, while increasing the gold thickness. Gold over electroless nickel creates brittle joints because of phosphorous in the nickel plating bath. The phosphorous migrates into the over-plating. Electrolytic nickel and gold plating should not be a problem. If you stay with the electroless nickel, keep the phosphorous at a mid [7 - 9%] level. Just as important, don't let the immersion gold get too aggressive. The immersion gold works by corroding the nickel. If it is too aggressive it takes away the nickel and leave phosphorous behind. This makes it look like the phosphorous level is too high in the nickel bath. Gold purity is very important for any type of wire bonding process. For aluminum wedge bonding, gold should have a purity of 99. 99% [no thalium] and the nickel becomes critical. No contaminates and the nickel wants to be plated a soft as possible. This requires good control of Ph and plating chemicals in the nickel-plating bath. Harman "Wire Bonding In Microelectronics" McGraw-Hill is a good resource for troubleshooting wire bonding. I reviewed it in the SMTnet Newsletter a couple of months ago. That said, electrolytic nickel + electrolytic gold does work well -- perhaps even better than ENEPIG: | |||
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tags: stretchable nanoparticle conductors gold polyurethane flocculation
date: 12-13-2013 02:12 gmt
revision:5
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PMID-23863931 Stretchable nanoparticle conductors with self-organized conductive pathways.
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PMID-21240559 Highly-compliant, microcable neuroelectrodes fabricated from thin-film gold and PDMS | |||
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PMID-19255461[0] Development and characterization of in vivo flexible electrodes compatible with large tissue displacements.
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PMID-22170970[0] A system for recording neural activity chronically and simultaneously from multiple cortical and subcortical regions in non-human primates. ____References____
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IEEE-4502738 (pdf) An Integrated-Circuit Approach to Extracellular Microelectrodes
____References____ Wise, Kensall D. and Angell, James B. and Starr, Arnold An Integrated-Circuit Approach to Extracellular Microelectrodes Biomedical Engineering, IEEE Transactions on BME-17 3 238 -247 (1970) |