Environmental Aging and Deadhesion of Polyimide Dielectric films
- At 35C, 85% RH (not immersion!) there was little degradation in the polyimide to 2000 hours.
- Suggest chromium or titanium as an adhesion promoter & to prevent copper from diffusing into the polyimide.
- Plasma treatment of polyimide is commonly used prior to metal deposition in order to improve adhesion of polyimide to metallization [20].
- Clearfield, Furman, Callegari 1994 "The Role of Physical and Chemical Structure in the Long-term Durability of Metal/Polyimide Interfaces" International Journal of Microcircuits and electronic Packaging 17(3), pp. 228-35.
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