Plasma removal of Parylene C
- Ellis Meng, Po-Ying Li and Yu-Chong Tai USC / Caltech
- Technics O2 plasma etch works, as do DRIE / RIE etch; all offer varying degrees of anisotropy, with the more intricate processes offering straighter sidewalls.
- Suggested parameters for O2 etch is 200sccm / 200W.
- Etch will be somewhat isotropic -- top of photoresist will be etched away, leading to ~15deg sloped sidewalls.
- Hence, small parylene features will be narrowed by the 02 plasma.
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