"Stage 6" part selection:
- B527 to replace the BF537 -- big difference are more pins + USB OTG high-speed port. The previous deign used Maxim's MAX3421E, which seems to drop packets / have limited bandwidth (or perhaps my USB profile is incorrect?)
- available in both 0.8mm and 0.5mm BGA. which? both are available from Digi-key. Coarser one is fine, will be easier to route.
- Does not support mobile SDRAM nor DDR SDRAM; just the vanilla variety.
- Continue to use the BF532 on the wireless devices (emg, neuro)
- LAN8710 to replace the LAN83C185. Both can use the MII interface; the LAN83 is not recommended for new designs, though it is in the easier-to-debug TQFP package. Blackfin EZ-KIT for BF527 uses the LAN8710.
- comes in 0.5mm pitch QFN-32 package.
- 3.3V and 1.2V supply - can supply 1.2V externally.
- SDRAM: MT48LC16M16A2BG-7E:D, digikey 557-1220-1-ND 16M x16, or 4M x 16 bit X 4 banks.
- VFBGA-54 package.
- 3.3v supply.
- converter: AD7689 8 channel, 16-bit SAR ADC. has a built-in sequencer, which is sweet. (as well as a temperature sensor??!)
- Package: 20LFCSP.
- Seems we can run it at 4.0V, as in stage4.
- Inst amp: MCP4208, available MSOP-8 (they call it 8-muMax). can use the same circuitry as in stage2 - just check the bandwidth; want 2khz maybe?
- M25P16 flash, same as on the dev board.
- Digikey M25P16-VMN6P-ND : 150mil width SOIC-8
- USB: use the on-board high-speed controller. No need for OTG functionality; FCI USB connector is fine. Digikey 609-1039-ND.
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